"multilayer" CNS Standards List |
|
CNS 21003-1
2018 Edition multilayer piping systems for hot and cold water installations inside buildings − Part 1: General 建築物內冷熱水裝置用多層管配管系統－第1部：通則 |
|
|
|
CNS 21003-2
2018 Edition multilayer piping systems for hot and cold water installations inside buildings − Part 2: Pipes 建築物內冷熱水裝置用多層管配管系統－第2部：管 |
|
|
|
CNS 21003-7
2018 Edition multilayer piping systems for hot and cold water installations inside buildings − Part 7: Guidance for the assessment of conformity 建築物內冷熱水裝置用多層管配管系統－第7部：符合性評鑑指引 |
|
|
|
CNS 21003-3
2018 Edition multilayer piping systems for hot and cold water installations inside buildings − Part 3: Fittings 建築物內冷熱水裝置用多層管配管系統－第3部：管件 |
|
|
|
CNS 21003-5
2018 Edition multilayer piping systems for hot and cold water installations inside buildings − Part 5: Fitness for purpose of the system 建築物內冷熱水裝置用多層管配管系統－第5部：系統適合度 |
|
|
|
CNS 10851
2017 Edition multilayer printed wiring boards 多層印刷電路板 |
|
|
|
CNS 13198
2017 Edition Fixed multilayer Ceramic Chip Capacitors for Use in Electronic Equipment 電子設備用固定多層陶瓷晶片電容器 |
|
|
|
CNS 14735-9
2017 Edition Specification for flexible multilayer printed boards with through connections 具導孔之軟性多層印刷電路板規格 |
|
|
|
CNS 14735-9
2003 Edition Specification for flexible multilayer printed boards with through connections 具導孔之軟性多層印刷電路板規格 |
|
|
|
CNS 10851
2000 Edition multilayer printed wiring boards 多層印刷電路板 |
|
|
|
CNS 13198
1993 Edition Fixed multilayer Ceramic Chip Capacitors for Use in Electronic Equipment 電子設備用固定多層陶瓷晶片電容器 |
|
| Find out:11Items | To Page of: First -Previous-Next -Last | 1 |
